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열초음파를 이용한 ACF COB(Chip-on-Board)접합 프로세스
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 송용 | - |
| dc.contributor.author | 임병승 | - |
| dc.contributor.author | 정진석 | - |
| dc.contributor.author | 김종민 | - |
| dc.date.available | 2019-06-26T01:20:18Z | - |
| dc.date.issued | 2011 | - |
| dc.identifier.issn | 2466-2232 | - |
| dc.identifier.issn | 2466-2100 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/26124 | - |
| dc.format.extent | 4 | - |
| dc.publisher | 대한용접접합학회 | - |
| dc.title | 열초음파를 이용한 ACF COB(Chip-on-Board)접합 프로세스 | - |
| dc.title.alternative | ACF COB Bonding Process using Thermosonic | - |
| dc.type | Article | - |
| dc.identifier.bibliographicCitation | 대한용접접합학회지, v.29, no.1, pp 25 - 28 | - |
| dc.identifier.kciid | ART001527706 | - |
| dc.description.isOpenAccess | N | - |
| dc.citation.endPage | 28 | - |
| dc.citation.number | 1 | - |
| dc.citation.startPage | 25 | - |
| dc.citation.title | 대한용접접합학회지 | - |
| dc.citation.volume | 29 | - |
| dc.description.journalRegisteredClass | kci | - |
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Collections - College of Engineering > School of Mechanical Engineering > 1. Journal Articles
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