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열초음파를 이용한 ACF COB(Chip-on-Board)접합 프로세스ACF COB Bonding Process using Thermosonic
- Issue Date
- 2011
- Publisher
- 대한용접접합학회
- Citation
- 대한용접접합학회지, v.29, no.1, pp 25 - 28
- Pages
- 4
- Journal Title
- 대한용접접합학회지
- Volume
- 29
- Number
- 1
- Start Page
- 25
- End Page
- 28
- ISSN
- 2466-2232
2466-2100
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- There are no files associated with this item.
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Collections - College of Engineering > School of Mechanical Engineering > 1. Journal Articles
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