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QFP 패키지의 새로운 고주파 등가 회로 모델New High-Frequency Equivalent Circuit Model for QFP Package
- Issue Date
- Jul-2005
- Publisher
- 대한전기학회
- Keywords
- QFP; Bonding Wire; Lead Frame; S-parameters; Radio Frequency
- Citation
- 전기학회논문지 C권, v.54, no.7(C), pp 339 - 342
- Pages
- 4
- Journal Title
- 전기학회논문지 C권
- Volume
- 54
- Number
- 7(C)
- Start Page
- 339
- End Page
- 342
- ISSN
- 1229-246X
- Abstract
- We present a new high-frequency equivalent circuit model for 52pin QFP used in typical IC's and extract R, L, and C values of this circuit model using a 3-D E & M field simulator. Futhermore, L and C value variations as a function of pin number due to the shape differences of the leads have been fitted to 2nd order polynomials in order to extend the applicability of this model.
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