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저유전체 고분자 접착 물질을 이용한 웨이퍼 본딩을 포함하는 웨이퍼 레벨 3차원 집적회로 구현에 관한 연구A Study on Wafer-Level 3D Integration Including Wafer Bonding using Low-k Polymeric Adhesive
- Authors
- 권용재; 석종원; Jian-Qiang Lu; Timothy Cale; Ronald Gutmann
- Issue Date
- 2007
- Publisher
- 한국화학공학회
- Keywords
- Three-dimensional Integration Circuits; Cu Damascene; Wafer Bonding; Low-k Polymeric Adhesive; Bond Strength
- Citation
- Korean Chemical Engineering Research(HWAHAK KONGHAK), v.45, no.5, pp 466 - 472
- Pages
- 7
- Journal Title
- Korean Chemical Engineering Research(HWAHAK KONGHAK)
- Volume
- 45
- Number
- 5
- Start Page
- 466
- End Page
- 472
- ISSN
- 0304-128X
2233-9558
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Collections - College of Engineering > School of Mechanical Engineering > 1. Journal Articles
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