언더필이 적용된 μBGA 솔더 접합부의 열피로특성Thermal Fatigue Characteristics of μBGA Solder Joints with Underfill
- Authors
- 고영욱; 김종민; 이준환; 신영의
- Issue Date
- 2003
- Publisher
- 대한용접접합학회
- Citation
- 대한용접접합학회지, v.21, no.4, pp 25 - 30
- Pages
- 6
- Journal Title
- 대한용접접합학회지
- Volume
- 21
- Number
- 4
- Start Page
- 25
- End Page
- 30
- URI
- https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/32100
- ISSN
- 2466-2232
2466-2100
- Abstract
- There have been many researches for small scale packages such as CSP, BGA, and Flipchip. Underfill encapsulant technology is one of the latest assembly technologies. The underfill encapsulant could enhance the reliability of the packages by flowing into the gap between die and substrate. In this paper, the effects of underfill packages by both aspects of thermal and mechanical reliabilities are studied. Especially, it is focused to value board-level reliability whether by the underfill is applied or not. First of all, The predicted thermal fatigue lifes of underfilled and no underfilled μBGA solder joints are performed by Coffin-Manson's equation and FEA program, ANSYS(version 5.62). Also, the thermal fatigue lifes of μBGA solder joints are experimented by thermal cycle test during the temperature, 218K to 423K. Consequently, both experimental and numerical study show that μBGA with underfill has over ten times better fatigue life than μBGA without underfill.
- Files in This Item
- There are no files associated with this item.
- Appears in
Collections - College of Engineering > School of Mechanical Engineering > 1. Journal Articles
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.