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A novel method for Cu electrodeposition on indium tin oxide aided by two-step Sn-Pd activation
- Authors
- Kim, JJ; Kim, Soo-Kil; Kim, YS
- Issue Date
- Sep-2003
- Publisher
- JAPAN SOC APPLIED PHYSICS
- Keywords
- Cu; electrode position; ITO; Pd; activation
- Citation
- JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, v.42, no.9AB, pp L1080 - L1082
- Journal Title
- JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS
- Volume
- 42
- Number
- 9AB
- Start Page
- L1080
- End Page
- L1082
- ISSN
- 0021-4922
1347-4065
- Abstract
- Surface modification using the two-step wet activation method consisting of Sri sensitization and Pd activation was introduced to Cu electrodeposition on indium tin oxide (ITO). Pd particles formed on the ITO surface through two-step Sn-Pd activation mediated the electron transfer at the interface and resulted in high-density instantaneous nucleation. Unlike the sparse cluster-type deposits on bare ITO, Cu electrodeposition on Sn-Pd activated ITO enabled the deposition of bright, continuous, and (111)-predominant Cu films on seedless ITO substrate.
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