Silver direct electrodeposition on Ru thin films
- Authors
- Koo, Hyo-Chol; Cho, Sung Ki; Lee, Chang Hwa; Kim, Soo-Kil; Kwon, Oh Joong; Kim, Jae Jeong
- Issue Date
- May-2008
- Publisher
- ELECTROCHEMICAL SOC INC
- Citation
- JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.155, no.5, pp D389 - D394
- Journal Title
- JOURNAL OF THE ELECTROCHEMICAL SOCIETY
- Volume
- 155
- Number
- 5
- Start Page
- D389
- End Page
- D394
- URI
- https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/42465
- DOI
- 10.1149/1.2890394
- ISSN
- 0013-4651
1945-7111
- Abstract
- Electrodeposition of Ag was performed on Ru thin films following electrochemical reduction of native Ru oxide. Oxide reduction in a tetramethylammonium hydroxide solution was critical for the formation of continuous Ag film, and a large overpotential was important for high-density nucleation. From a kinetics viewpoint, the thermal stability of the Ag film was improved by the application of a more negative potential, which suggested that better nucleation density at the initial stage of growth induced better substrate adhesion. Suppression of growth by addition of an organic additive generated a larger and more uniformly distributed initial population of Ag particles, and as a result a smooth film was obtained. (C) 2008 The Electrochemical Society.
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