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Sn-3.5Ag, Sn-3.5Ag-0.7Cu, Sn-3.5Ag-3.0In-0.5Bi Solder를 이용한 Μbga Solder 접합부의 열피로 수명예측Prediction of Thermal Fatigue Life on μBGA Solder Joint Using Sn-3.5Ag, Sn-3.5Ag-0.7Cu and Sn-3.5Ag-3.0In-0.5Bi Solder Alloys
- Issue Date
- 2003
- Publisher
- 대한용접접합학회
- Citation
- 대한용접접합학회지, v.21, no.3, pp 92 - 98
- Pages
- 7
- Journal Title
- 대한용접접합학회지
- Volume
- 21
- Number
- 3
- Start Page
- 92
- End Page
- 98
- ISSN
- 2466-2232
2466-2100
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- There are no files associated with this item.
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Collections - College of Engineering > School of Mechanical Engineering > 1. Journal Articles
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