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Flexible Display 기판 위의 Bending에 따른 ITO 필름의 Stress 분포The Stress Distribution of Indium-tin-oxide (ITO) Film on Flexible Display Substrate by Bending

Authors
박준백황정연서대식박성규문대규한정인
Issue Date
Dec-2003
Publisher
한국전기전자재료학회
Keywords
pattern; position; stress; ITO film; bending; flexible
Citation
전기전자재료학회논문지, v.16, no.12S, pp 1115 - 1120
Pages
6
Journal Title
전기전자재료학회논문지
Volume
16
Number
12S
Start Page
1115
End Page
1120
URI
https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/51231
DOI
10.4313/JKEM.2003.16.12.1115
ISSN
1226-7945
Abstract
In this paper, we investigated the position-dependent stress distribution of indium-tin-oxide (ITO) film on Polycarbonate (PC) substrate by external bending force. It was found that there are the maximum crack density at the center position and decreasing crack density as goes to the edge. In accordance with crack distribution, it was observed that the change of electrical resistivity of ITO islands is maximum at the center and decrease as goes to the edge. From the result that crack density is increasing at same island position as face-plate distance (L) decreases, it is evident that the more stress is imposed on same island position as L decreases.
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Park, Sung Kyu
창의ICT공과대학 (전자전기공학부)
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