Effect of Atmospheric-Pressure Plasma Treatment on the Joint Strength between Au Flip Chip Bumps and Cu-Finished Si Wafer Substrates Bonded Using Ultrasonic Energy
DC Field | Value | Language |
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dc.contributor.author | Jo, Jung-Lae | - |
dc.contributor.author | Koo, Ja-Myeong | - |
dc.contributor.author | Lee, Jong-Bum | - |
dc.contributor.author | Lee, Jong-Gun | - |
dc.contributor.author | Jung, Seung-Boo | - |
dc.contributor.author | Jeon, Sung-Ho | - |
dc.contributor.author | Kim, Jong-Min | - |
dc.contributor.author | Moon, Jeong-Hoon | - |
dc.date.accessioned | 2022-01-06T07:06:13Z | - |
dc.date.available | 2022-01-06T07:06:13Z | - |
dc.date.issued | 2009-03 | - |
dc.identifier.issn | 0374-4884 | - |
dc.identifier.issn | 1976-8524 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/52989 | - |
dc.description.abstract | This study investigated the effects of the conditions of atmospheric-pressure plasma (APP) treatment on the ultrasonic bonding property of Ail flip chip bumps on Cu-finished silicon substrates. The substrate underwent the de-ionized (DI)-water spreading test and a surface analysis using Auger electron spectroscopy (AES) after plasma treatment had been performed for various treatment times from 0.3 s to 18 s with three different gases: N-2, N-2+O-2 and N-2+H-2. The treatment conditions greatly affected the spreading angle and the joint strength. The gases containing 02 and H-2 were effective in improving the wettability of the substrate and the bondability between the All bump and the Cu substrate, respectively. | - |
dc.format.extent | 5 | - |
dc.language | 영어 | - |
dc.language.iso | ENG | - |
dc.publisher | KOREAN PHYSICAL SOC | - |
dc.title | Effect of Atmospheric-Pressure Plasma Treatment on the Joint Strength between Au Flip Chip Bumps and Cu-Finished Si Wafer Substrates Bonded Using Ultrasonic Energy | - |
dc.type | Article | - |
dc.identifier.doi | 10.3938/jkps.54.1334 | - |
dc.identifier.bibliographicCitation | JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.54, no.3, pp 1334 - 1338 | - |
dc.identifier.kciid | ART001498496 | - |
dc.description.isOpenAccess | N | - |
dc.identifier.wosid | 000264197400072 | - |
dc.identifier.scopusid | 2-s2.0-64549113762 | - |
dc.citation.endPage | 1338 | - |
dc.citation.number | 3 | - |
dc.citation.startPage | 1334 | - |
dc.citation.title | JOURNAL OF THE KOREAN PHYSICAL SOCIETY | - |
dc.citation.volume | 54 | - |
dc.type.docType | Article; Proceedings Paper | - |
dc.publisher.location | 대한민국 | - |
dc.subject.keywordAuthor | Ultrasonic bonding | - |
dc.subject.keywordAuthor | Flip chip | - |
dc.subject.keywordAuthor | Atmospheric-pressure plasma treatment | - |
dc.subject.keywordAuthor | Surface cleaning | - |
dc.subject.keywordAuthor | Die shear test | - |
dc.subject.keywordAuthor | Gold (Au) bump | - |
dc.subject.keywordAuthor | Surface analysis | - |
dc.subject.keywordAuthor | Copper (Cu) | - |
dc.subject.keywordAuthor | Silicon (Si) wafer | - |
dc.subject.keywordPlus | GOLD | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Physics, Multidisciplinary | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.description.journalRegisteredClass | kci | - |
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