Effect of Atmospheric-Pressure Plasma Treatment on the Joint Strength between Au Flip Chip Bumps and Cu-Finished Si Wafer Substrates Bonded Using Ultrasonic Energy
- Authors
- Jo, Jung-Lae; Koo, Ja-Myeong; Lee, Jong-Bum; Lee, Jong-Gun; Jung, Seung-Boo; Jeon, Sung-Ho; Kim, Jong-Min; Moon, Jeong-Hoon
- Issue Date
- Mar-2009
- Publisher
- KOREAN PHYSICAL SOC
- Keywords
- Ultrasonic bonding; Flip chip; Atmospheric-pressure plasma treatment; Surface cleaning; Die shear test; Gold (Au) bump; Surface analysis; Copper (Cu); Silicon (Si) wafer
- Citation
- JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.54, no.3, pp 1334 - 1338
- Pages
- 5
- Journal Title
- JOURNAL OF THE KOREAN PHYSICAL SOCIETY
- Volume
- 54
- Number
- 3
- Start Page
- 1334
- End Page
- 1338
- URI
- https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/52989
- DOI
- 10.3938/jkps.54.1334
- ISSN
- 0374-4884
1976-8524
- Abstract
- This study investigated the effects of the conditions of atmospheric-pressure plasma (APP) treatment on the ultrasonic bonding property of Ail flip chip bumps on Cu-finished silicon substrates. The substrate underwent the de-ionized (DI)-water spreading test and a surface analysis using Auger electron spectroscopy (AES) after plasma treatment had been performed for various treatment times from 0.3 s to 18 s with three different gases: N-2, N-2+O-2 and N-2+H-2. The treatment conditions greatly affected the spreading angle and the joint strength. The gases containing 02 and H-2 were effective in improving the wettability of the substrate and the bondability between the All bump and the Cu substrate, respectively.
- Files in This Item
- There are no files associated with this item.
- Appears in
Collections - College of Engineering > School of Mechanical Engineering > 1. Journal Articles
![qrcode](https://api.qrserver.com/v1/create-qr-code/?size=55x55&data=https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/52989)
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.