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Furnace O-2 Annealing Growth of Cu2O Thin Film for Thin-Film Transistors at Low Temperature

Authors
Woo, Jong-ChangJoo, Young-HeeKim, Chang-Il
Issue Date
Dec-2016
Publisher
AMER SCIENTIFIC PUBLISHERS
Keywords
High-k Dielectric; Cu2O; O-2 Furnace Annealing
Citation
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.16, no.12, pp 12878 - 12881
Pages
4
Journal Title
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY
Volume
16
Number
12
Start Page
12878
End Page
12881
URI
https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/6353
DOI
10.1166/jnn.2016.13682
ISSN
1533-4880
1533-4899
Abstract
Cuprous oxide (Cu2O) film has been grown via O-2 annealing on Si(100) with a furnace. The impact of Si surface passivation by O-2 annealing growth was investigated. We studied variations in the surface composition of Cu2O at various furnace annealing temperatures and amounts of O-2 gas. Prolonged annealing of Cu2O results in a formation of a thick layer of Cu2O at the surface, while a short annealing time of Cu2O produces a thin film of Cu metal. The thick Cu2O film generated from the sputtering deposited a Cu layer, which was oxidized by heating at 200-400 degrees C in 10-30 sccm of O-2 gas. In the case of Cu film, the extent of reduction varies with the thermal history of the samples, with prolonged annealing producing a more reducible surface. Cu2O thin film grown from a Cu metal layer shows a diffusion of lattice oxygen corresponding to the characteristics of the thin film.
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Kim, Chang Il
창의ICT공과대학 (전자전기공학부)
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