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핫 캐리어 신뢰성 개선을 위한 새로운 LDD 구조에 대한 연구A Study on New LDD Structure for Improvements of Hot Carrier Reliability

Authors
서용진김상용이우선장의구
Issue Date
Jan-2002
Publisher
한국전기전자재료학회
Keywords
Surface type LDD(SL); Buried type LDD(BL); Surface Implantation type LDD(SI); hotcarrier reliability; spacer induced degradation; hot carrier lifetime; Surface type LDD(SL); Buried type LDD(BL); Surface Implantation type LDD(SI); hotcarrier reliability; spacer induced degradation; hot carrier lifetime
Citation
전기전자재료학회논문지, v.15, no.1
Journal Title
전기전자재료학회논문지
Volume
15
Number
1
URI
https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/66021
ISSN
1226-7945
Abstract
The hot carrier degradation in a metal oxide semiconductor device has been one of the most serious concerns for MOS-ULSI. In this paper, three types of LDD(lightly doped drain) structure for suppression of hot carrier degradation, such as decreasing of performance due to spacer-induced degradation and increase of series resistance will be investigated. in this study, LDD-nMOSFETs used had three different drain structure, (1)conventional surface type LDD(SL), (2)Buried type LDD(BL), (3)Surface implantation type LDD(SI). As experimental results, the surface implantation type LDD structure showed that improved hot carrier lifetime to comparison with conventional surface and buried type LDD structures.
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