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플립 칩 솔더 범프의 접합강도와 금속간 화합물의 시효처리 특성Aging Characteristic of Intermetallic Compounds and BondingStrength of Flip-Chip Solder Bump
- Issue Date
- 2002
- Publisher
- 한국마이크로전자및패키징학회
- Citation
- 마이크로전자 및 패키징학회지, v.9, no.1, pp 6 - 41
- Pages
- 36
- Journal Title
- 마이크로전자 및 패키징학회지
- Volume
- 9
- Number
- 1
- Start Page
- 6
- End Page
- 41
- ISSN
- 1226-9360
- Files in This Item
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