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Comparison of switching characteristics of HfOx RRAM device with different switching layer thicknesses

Authors
Lee, Dong KeunKim, Min-HwiBang, SuhyunKim, Tae-HyeonChoi, Yeon-JoonKim, SungjunCho, SeongjaePark, Byung-Gook
Issue Date
2019
Publisher
IEEE
Citation
2019 SILICON NANOELECTRONICS WORKSHOP (SNW), pp 69 - 70
Pages
2
Journal Title
2019 SILICON NANOELECTRONICS WORKSHOP (SNW)
Start Page
69
End Page
70
URI
https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/72130
DOI
10.23919/snw.2019.8782952
ISSN
2161-4636
Abstract
This paper presents switching characteristics of Ni/HfOx/p(+)-Si with different switching layer thicknesses (5/10 nm) in DC mode. Larger forming voltage and on/off ratio is obtained from the 10 nm HfOx RRAM while step-like reset process is seen from 5 nm HfOx RRAM. From the measurement results, fabricated RRAM device with thicker switching layer is more suitable for nonvolatile memory operation while thinner HfOx layer has potential for application in neuromorphic computing system.
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창의ICT공과대학 (전자전기공학부)
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