Through-hole filling characteristics of solderable polymer composites with low melting point alloy fillers
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Jeong Il | - |
dc.contributor.author | Yim, Byung-Seung | - |
dc.contributor.author | Yun, Mu Seong | - |
dc.contributor.author | Kim, Jong-Min | - |
dc.date.available | 2019-03-08T13:56:29Z | - |
dc.date.issued | 2016-01 | - |
dc.identifier.issn | 0957-4522 | - |
dc.identifier.issn | 1573-482X | - |
dc.identifier.uri | https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/7416 | - |
dc.description.abstract | In this paper, we describe the development of a novel through-hole filling technique using solderable polymer composites (SPCs) with low-melting-point-alloy (LMPA) fillers. Three types of SPCs with different LMPA concentrations (40, 50 and 60 vol%) were formulated, and through-hole filling tests were conducted under different environmental reflow conditions (atmospheric pressure and decompression conditions). The results indicated that the through-hole filling assemblies showed weak filling characteristics with huge defects under atmospheric pressure reflow conditions because polymer trapped in the hole. On the other hand, the through-hole filling assemblies fabricated under decompression reflow conditions showed favorable filling characteristics and excellent, stable electrical properties due to the effective removal of polymer from the through-hole. | - |
dc.format.extent | 10 | - |
dc.language | 영어 | - |
dc.language.iso | ENG | - |
dc.publisher | SPRINGER | - |
dc.title | Through-hole filling characteristics of solderable polymer composites with low melting point alloy fillers | - |
dc.type | Article | - |
dc.identifier.doi | 10.1007/s10854-015-3842-1 | - |
dc.identifier.bibliographicCitation | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.27, no.1, pp 982 - 991 | - |
dc.description.isOpenAccess | N | - |
dc.identifier.wosid | 000368054600128 | - |
dc.identifier.scopusid | 2-s2.0-84954386864 | - |
dc.citation.endPage | 991 | - |
dc.citation.number | 1 | - |
dc.citation.startPage | 982 | - |
dc.citation.title | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | - |
dc.citation.volume | 27 | - |
dc.type.docType | Article | - |
dc.publisher.location | 네델란드 | - |
dc.subject.keywordPlus | UNDERFILL | - |
dc.subject.keywordPlus | ADHESIVE | - |
dc.subject.keywordPlus | TSV | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.relation.journalWebOfScienceCategory | Physics, Condensed Matter | - |
dc.description.journalRegisteredClass | sci | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
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