Through-hole filling characteristics of solderable polymer composites with low melting point alloy fillers
- Authors
- Lee, Jeong Il; Yim, Byung-Seung; Yun, Mu Seong; Kim, Jong-Min
- Issue Date
- Jan-2016
- Publisher
- SPRINGER
- Citation
- JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.27, no.1, pp 982 - 991
- Pages
- 10
- Journal Title
- JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Volume
- 27
- Number
- 1
- Start Page
- 982
- End Page
- 991
- URI
- https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/7416
- DOI
- 10.1007/s10854-015-3842-1
- ISSN
- 0957-4522
1573-482X
- Abstract
- In this paper, we describe the development of a novel through-hole filling technique using solderable polymer composites (SPCs) with low-melting-point-alloy (LMPA) fillers. Three types of SPCs with different LMPA concentrations (40, 50 and 60 vol%) were formulated, and through-hole filling tests were conducted under different environmental reflow conditions (atmospheric pressure and decompression conditions). The results indicated that the through-hole filling assemblies showed weak filling characteristics with huge defects under atmospheric pressure reflow conditions because polymer trapped in the hole. On the other hand, the through-hole filling assemblies fabricated under decompression reflow conditions showed favorable filling characteristics and excellent, stable electrical properties due to the effective removal of polymer from the through-hole.
- Files in This Item
- There are no files associated with this item.
- Appears in
Collections - College of Engineering > School of Mechanical Engineering > 1. Journal Articles
![qrcode](https://api.qrserver.com/v1/create-qr-code/?size=55x55&data=https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/7416)
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.