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Results 31-40 of 237 (Search time: 0.021 seconds).

Comparison of the Electrical Properties for Etched and As-Deposited BET Thin Films

Lim, K.-T.; Kim, K.-T.; Kim, D.-P.; Kim, C.-I.

ArticleIssue Date2003CitationIEEE International Conference on Plasma Science, pp 403
Characterization of ferroelectric Bi3.25La0.75Ti3O12 thin films prepared by metal organic decomposition method

Kim, KT; Kim, CI

ArticleIssue Date2005CitationTHIN SOLID FILMS, v.478, no.1-2, pp 6 - 12PublisherELSEVIER SCIENCE SA
Effects of Temperature on the Etching Properties of Bi 4-xLaxTi3O12 Thin Films

Kim, D.P.; Kim, K.T.; Kim, C.I.

ArticleIssue Date2003CitationIEEE International Conference on Plasma Science, pp 131
The Simple Model for Ion-assisted Etching Using Cl2/Ar Inductively Coupled Plasma

Efremov, A.M.; Kim, D.P.; Kim, C.I.

ArticleIssue Date2003CitationIEEE International Conference on Plasma Science, pp 130
Dry etching characteristics of TiN thin films in BCl3-based plasma

Woo, J.-C.; Park, J.-S.; Kim, C.-I.

ArticleIssue Date2011CitationTransactions on Electrical and Electronic Materials, v.12, no.3, pp 106 - 109Publisher한국전기전자재료학회
Dry etching characteristics of indium zinc oxide thin films in adaptive coupled plasma

Woo, J.-C.; Choi, C.-A.; Kim, C.-I.

ArticleIssue Date2013CitationTransactions on Electrical and Electronic Materials, v.14, no.4, pp 216 - 220Publisher한국전기전자재료학회
Surface properties of ZrO2 thin film under Cl-2/Ar plasma using angle-resolved X-ray photoelectron spectroscopy

Woo, Jong-Chang; Choi, Chang-Auck; Yang, Woo-Seok; Chun, Yoon-Soo; Kim, Chang-Il

ArticleIssue Date2014CitationJAPANESE JOURNAL OF APPLIED PHYSICS, v.53, no.8PublisherIOP PUBLISHING LTD
The use of high density plasma system to improve the etch properties of the zinc tin oxide thin film for transparent thin film transistors active layers

Woo, Jong-Chang; Chun, Yoon-Soo; Kim, Chang-Il

ArticleIssue Date2014CitationAPPLIED SURFACE SCIENCE, v.292, pp 915 - 920PublisherELSEVIER SCIENCE BV
The fabrication of an applicative device for trench width and depth using inductively coupled plasma and the bulk silicon etching process

Woo, J.-C.; Choi, C.-A.; Kim, C.-I.

ArticleIssue Date2014CitationTransactions on Electrical and Electronic Materials, v.15, no.1, pp 49 - 54Publisher한국전기전자재료학회
The dry etching characteristics of TiO2 thin films in N2/CF4/Ar plasma

Choi, K.-R.; Woo, J.-C.; Joo, Y.-H.; Chun, Y.-S.; Kim, C.-I.

ArticleIssue Date2014CitationTransactions on Electrical and Electronic Materials, v.15, no.1, pp 32 - 36Publisher한국전기전자재료학회
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