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The etching mechanism of (Ba,Sr)TiO3 films using Cl-2/Ar inductively coupled plasma

Kim, S.-B.; Chang, E.-G.; Kim, C.-I.

ArticleIssue Date1999CitationJOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.35, no.SUPPL. 4, pp S716 - S720PublisherKOREAN PHYSICAL SOC

A study on the suppression of etch residues by O-2 gas addition in dry etching of Pt film

Kim, N.-H.; Kim, C.-I.; Chang, E.-G.; Kwon, K.-H.

ArticleIssue Date1999CitationJOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.35, no.SUPPL. 4, pp S806 - S809PublisherKOREAN PHYSICAL SOC

Suppression of corrosion phenomenon on Al-1 %Cu surface with fluorine treatment

Kim, S.G.; Baek, K.H.; Kim, J.; Koo, J.G.; Kim, D.Y.; Kim, I.S.; Kwon, K.H.; Kim, C.I.

ArticleIssue Date1999CitationJOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.35, no.SUPPL. 2, pp S357 - S360PublisherKOREAN PHYSICAL SOC

Angle-resolved XPS investigation of the fluorine-related passivation layer on etched Al (Cu 1%) surface after SF6 treatment

Yoon, Y.S.; Baek, K.H.; Park, J.M.; Kwon, K.H.; Kim, C.I.; Hwang, I.G.

ArticleIssue Date1999CitationJOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.34, no.SUPPL. 3, pp S305 - S309PublisherKOREAN PHYSICAL SOC

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