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Showing results 1 to 17 of 17

SCIESCOPUS
Adhesion and removal of alumina slurry particles on wafer surfaces in CuCMPGo to Link

Hong, Yi-Koan; Han, Ja Hyung; Lee, Jin hyung; Park, Jin-Goo; Busnaina, Ahmed A

ArticleIssue Date2005CitationSolid State Phenomena, v.103-104, pp 275 - 278PublisherScitec Publications Ltd.
SCIESCOPUS
Adhesion and removal of silica and ceria particles on the wafer surfaces in STI and poly Si CMPGo to Link

Hong, Yi-Koan; Kang, Young Jae; Park, Jin-Goo; Han, Sang Yeob; Yun, Seong Kyu; Yoon, Bo Un; Hong, Chang Ki

ArticleIssue Date2008CitationSolid State Phenomena, v.134, pp 159 - 163PublisherScitec Publications Ltd.
Effect of corrosion inhibitor (BTA) in citric acid based slurry on Cu CMP

Kim, In-Kwon; Kang, Young-Jae; Hong, Yi-Koan; Park, Jin-Goo

ConferenceIssue Date2005PlaceSan Francisco, CA
Effect of corrosion inhibitor, 1H-benzotriazole (BTAH), on particle adhesion in Cu CMP

Song, Jae-Hoon; Hong, Yi-Koan; Kim, Tae-Gon; Kang, Young-Jae; Kim, In-Kwon; Ran, Ja-Hyung; Park, Jin-Goo; Busnaina, Ahmed A.

ConferenceIssue Date2005Place미국; Los Angeles, CA
OTHER
Effect of Corrosion inhibitor, Benzotriazole(BTA), on Particle Adhesion in Cu CMPGo to Link

Song, Jae-Hoon; Hong, Yi-Koan; Kim, Tae-Gon; Park, Jin-Goo

ArticleIssue Date2005Citation한국전기전자재료학회 추계학술대회 논문집, pp 366 - 367Publisher한국전기전자재료학회
SCOPUS
Effect of poly silicon wettability on polymeric residue contaminationGo to Link

Kang, Young-Jae; Park, Jin-Goo; Hong, Yi-Koan; Han, Sang Yeob; Yun, Seong Kyu; Yoon, Bo Un; Hong, ChangKi

ArticleIssue Date2007CitationECS Transactions, v.11, no.2, pp 455 - 461PublisherElectrochemical Society, Inc.
SCIESCOPUS
Effect of Polysilicon Wettability on Polishing and Organic Defects during CMPGo to Link

Park, Jin-Goo; Prasad, Y. Nagendra; Kang, Young-Jae; Kim, In-Kwon; Hong, Yi-Koan; Han, Sang-Yeob; Yun, Seong-Kyu; Yoon, Bo-Un; Busnaina, Ahmed A.

ArticleIssue Date2009CitationJournal of the Electrochemical Society, v.156, no.11, pp H869 - H873PublisherElectrochemical Society, Inc.
Effect of wettability of poly silicon on CMP behavior

Kang, Young-Jae; Kang, Bong Kyun; Kim, In-Kwon; Park, Jin-Goo; Hong, Yi-Koan; Han, Sang Yeob; Yun, Seong Kyu; Yoon, Bo Un; Hong, Chang Ki

ConferenceIssue Date2007PlaceSan Francisco, CA
Effect of wettability of poly silicon on CMP behavior

Kang, Young-Jae; Kang, Bong-Kyun; Kim, In-Kwon; Park, Jin-Goo; Hong, Yi-Koan; Han, Sang Yeob; Yun, Seong-Kyu; Yoon, Bo-Un; Hong, Chang-Ki

ConferenceIssue Date2007PlaceSan Francisco, CA
Frictional behavior and particle adhesion of abrasive particles during Cu CMP

Hong, Yi-Koan; Han, Ja-Hyung; Song, Jae-Hoon; Park, Jin-Goo

ConferenceIssue Date2005PlaceSan Francisco, CA
SCIESCOPUS
Interfacial and electrokinetic characterization of IPA solutions related to semiconductor wafer drying and cleaningGo to Link

Park, Jin-Goo; Lee, Sang-Ho; Ryu, Ju-Suk; Hong, Yi-Koan; Kim, Tae-Gon; Busnaina, Ahmed A.

ArticleIssue Date2006CitationJournal of the Electrochemical Society, v.153, no.9, pp G811 - G814PublisherElectrochemical Society, Inc.
SCIESCOPUS
Particle adhesion and removal on EUV mask layers during wet cleaningGo to Link

Lee, Sang ho; Hong, Yi-Koan; Song, Jae-Hoon; Park, Jin-Goo; Busnaina, Ahmed A; Zhang, Guijing; Eschbach, Florence; Ramamoorthy, Arun

ArticleIssue Date2005CitationJapanese Journal of Applied Physics, v.44, no.7B, pp 5479 - 5483PublisherIOP Publishing Ltd
SCOPUS
Post-CMP CleaningGo to Link

Park, Jin-Goo; Busnaina, Ahmed A.; Hong, Yi-Koan

ArticleIssue Date2007CitationMicroelectronic Applications of Chemical Mechanical Planarization, pp 467 - 509PublisherJohn Wiley & Sons, Inc.
The adhesion of pad particles on wafer surfaces during Cu CMP

Song, Jae-Hoon; Han, Ja-Hyung; Hong, Yi-Koan; Kang, Young jae; Park, Jin-Goo; Maeng, Ju Ho; Won, Young Man

ConferenceIssue Date2005PlaceSan Francisco, CA
The adsorption behaviors of citric acid on abrasive particles in Cu CMP slurry

Kang, Young-Jae; Hong, Yi-Koan; Song, Jae-Hoon; Kim, In_Kwon; Park, Jin-Goo

ConferenceIssue Date2005PlaceSan Francisco, CA
SCIESCOPUS
The effect of additives in post-Cu CMP cleaning on particle adhesion and removalGo to Link

Hong, Yi-Koan; Eom, Dae hong; Lee, Sang ho; Kim, Tae Gon; Park, Jin-Goo; Busnaina, Ahmed A

ArticleIssue Date2004CitationJournal of the Electrochemical Society, v.151, no.11, pp G756 - G761PublisherElectrochemical Society, Inc.
SCIESCOPUS
The effect of frictional and adhesion forces attributed to slurry particles on the surface quality of polished copperGo to Link

Hong, Yi-Koan; Han, Ja-Hyung; Kim, Tae-Gon; Park, Jin-Goo; Busnaina, Ahmed A.

ArticleIssue Date2007CitationJournal of the Electrochemical Society, v.154, no.1, pp H36 - H40PublisherElectrochemical Society, Inc.
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