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Effect of Corrosion inhibitor, Benzotriazole(BTA), on Particle Adhesion in Cu CMPCu CMP중 BTA에 의한 Particle의 흡착에 관한 연구
- Other Titles
- Cu CMP중 BTA에 의한 Particle의 흡착에 관한 연구
- Authors
- Song, Jae-Hoon; Hong, Yi-Koan; Kim, Tae-Gon; Park, Jin-Goo
- Issue Date
- Nov-2005
- Publisher
- 한국전기전자재료학회
- Keywords
- BTA; Pad Particle; Zeta Potential; Adhesion Force
- Citation
- 한국전기전자재료학회 추계학술대회 논문집, pp.366 - 367
- Indexed
- OTHER
- Journal Title
- 한국전기전자재료학회 추계학술대회 논문집
- Start Page
- 366
- End Page
- 367
- ISSN
- 1226-7945
- Abstract
- The effect of benzotriazole (BTA) on the adhesion force of silica and pad particle on Cu/TEOS wafer surfaces was investigated with and without the addition of BTA. Cu-BTA had the isoelectric point (IEP) at around pH 4∼8. Pad particles were more positive zeta potentials than silica. The adhesion force initially decreased of silica and pad particle on Cu surfaces when BTA was added. However, the more BTA was added, the more adhesion force gradually increased with the increase of BTA concentrations. Then the adhesion force of pad particle was higher than silica. And TEOS didn't resulted increasing adhesion force like Cu when BTA was added in DI water.
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Related Researcher
- Park, Jin Goo
- ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)