선택적 전기화학 3D 프린터 기술 소개 및 PCB 양산공정 적용방식 고찰
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 김성빈 | - |
dc.contributor.author | 유봉영 | - |
dc.date.accessioned | 2022-07-18T01:38:43Z | - |
dc.date.available | 2022-07-18T01:38:43Z | - |
dc.date.created | 2021-08-25 | - |
dc.date.issued | 2021-06 | - |
dc.identifier.issn | 1225-8024 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/108281 | - |
dc.description.abstract | Some studies on electrochemical additive manufacturing of metals were summarized in this technical report, and development status of selective electrochemical 3D printing technology was introduced. In order to apply it to the PCB mass production process, essential considerations how to overcome the fundamental problems, such as the sizing, process sequence and PCB process design have been described. | - |
dc.language | 한국어 | - |
dc.language.iso | ko | - |
dc.publisher | 한국표면공학회 | - |
dc.title | 선택적 전기화학 3D 프린터 기술 소개 및 PCB 양산공정 적용방식 고찰 | - |
dc.title.alternative | Introduction of Selective Electrochemical Additive Manufacturing Technology and Consideration of Integration Method for PCB Mass Production Process | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | 유봉영 | - |
dc.identifier.doi | 10.5695/JKISE.2021.54.3.158 | - |
dc.identifier.bibliographicCitation | 한국표면공학회지, v.54, no.3, pp.158 - 163 | - |
dc.relation.isPartOf | 한국표면공학회지 | - |
dc.citation.title | 한국표면공학회지 | - |
dc.citation.volume | 54 | - |
dc.citation.number | 3 | - |
dc.citation.startPage | 158 | - |
dc.citation.endPage | 163 | - |
dc.type.rims | ART | - |
dc.identifier.kciid | ART002734853 | - |
dc.description.journalClass | 2 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | kci | - |
dc.subject.keywordAuthor | Copper | - |
dc.subject.keywordAuthor | 3D printing | - |
dc.subject.keywordAuthor | electroplating package | - |
dc.identifier.url | http://koreascience.or.kr/article/JAKO202121061557457.page | - |
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