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선택적 전기화학 3D 프린터 기술 소개 및 PCB 양산공정 적용방식 고찰Introduction of Selective Electrochemical Additive Manufacturing Technology and Consideration of Integration Method for PCB Mass Production Process
- Other Titles
- Introduction of Selective Electrochemical Additive Manufacturing Technology and Consideration of Integration Method for PCB Mass Production Process
- Issue Date
- Jun-2021
- Publisher
- 한국표면공학회
- Keywords
- Copper; 3D printing; electroplating package
- Citation
- 한국표면공학회지, v.54, no.3, pp.158 - 163
- Indexed
- KCI
- Journal Title
- 한국표면공학회지
- Volume
- 54
- Number
- 3
- Start Page
- 158
- End Page
- 163
- ISSN
- 1225-8024
- Abstract
- Some studies on electrochemical additive manufacturing of metals were summarized in this technical report, and development status of selective electrochemical 3D printing technology was introduced. In order to apply it to the PCB mass production process, essential considerations how to overcome the fundamental problems, such as the sizing, process sequence and PCB process design have been described.
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Related Researcher
- Yoo, Bong young
- ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)