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다이아몬드 분말상에 무전해 Ni-B 도금을 위한 계면활성제의 영향Effect of Surfactant in Electroless Ni-B Plating for Coating on the Diamond Powder
- Other Titles
- Effect of Surfactant in Electroless Ni-B Plating for Coating on the Diamond Powder
- Issue Date
- 2017
- Publisher
- 한국표면공학회
- Keywords
- Diamond wire saw; Diamond powder; Electroless deposition; Reducing agent; Complexing agent; Dispersant; Surfactant etc.
- Citation
- 한국표면공학회지, v.50, no.3, pp.177 - 182
- Indexed
- KCI
- Journal Title
- 한국표면공학회지
- Volume
- 50
- Number
- 3
- Start Page
- 177
- End Page
- 182
- ISSN
- 1225-8024
- Abstract
- The properties of electroless Ni-B thin film on diamond powder with different parameters (temperature, pH, surfactant etc.) were studied. The surface morphology, structure and composition distribution of the Ni- B film were observed by field effect scanning electron microscope (FE-SEM), energy-dispersive spectrometer (EDS), X-ray diffraction (XRD) and Auger electron spectroscopy (AES). The growth rate of Ni-B film was increased with increase of bath temperature. The B content in Ni-B film was reduced with increase of bath pH. As a result the structure of Ni-B film was changed from amorphous to crystalline structure. The PVP in solution plays multi-functional roles as a dispersant and a stabilizer. The Ni-B film deposited with adding 0.1 mM-PVP was strongly introduced an amorphous structure with higher B content (25 at.%). Also the crystallite size of Ni-B film was reduced from 12.7 nm to 5.4 nm.
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Related Researcher
- Yoo, Bong young
- ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)