Numerical Analysis of Electric Field Characteristics and Interfacial Pressure of HVDC XLPE Cable Joint Considering Load Cycles

Abstract

Recent innovations in HVDC extruded cable systems require the development of reliable and safe cable accessories. Cable accessories are made of several insulating materials and contain several interfaces. Interfaces made of different materials can cause electric field distortion and localized enhancement of the field. In addition, the internal temperature profiles of accessories differ depending on load conditions or installation environments, which may lead to an increase in or loss of interfacial pressure due to changes in the mechanical properties of materials. The loss of interfacial pressure degrades the contact state between materials. The micro voids formed due to pressure loss can cause partial discharge and tree, which in turn can lead to reduced lifespan and failure of the cable system. Therefore, it is necessary to study the electrical and mechanical characteristics of cable accessories considering various transient states. However, there is a limit to experimentally analyzing the actual structure. In this paper, electric field and mechanical stress for pre-molded cable joints were analyzed using an electrical model based on the conductivity of the material and a mechanical model based on elastic theory. Temperature fluctuations were simulated according to the sequence of the cable load cycle test, and time-varying electric fields and mechanical stresses were analyzed. From the simulation results, it was confirmed that the electric field and stress distribution in the joint continuously changed according to the heating and cooling periods. In addition, during the cooling cycle, the field strength at the interface near the conductor increased and the interface pressure decreased. In conclusion, it is important to ensure sufficient initial pressure so that the dielectric strength at the interface does not decrease even if there is a loss of interface pressure due to temperature fluctuations.