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Effect of colloidal silcia and copper ions on PVA brush contamination during post-Cu CMP cleaning

Authors
박진구
Issue Date
29-Sep-2022
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/112354
Place
온라인
Conference Name
2022 International Conference on Planarization/CMP Technology
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COLLEGE OF ENGINEERING SCIENCES > DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING > 2. Conference Papers

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Park, Jin Goo
ERICA 첨단융합대학 (ERICA 신소재·반도체공학전공)
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