Mechanism of PVA Brush Loading with Ceria Particles during Post-CMP Cleaning Process
- Authors
- Sahir, Samrina; Cho, Hwi-Won; Yerriboina, Nagendra Prasad; Kim, Tae-Gon; Hamada, Satomi; Park, Jin Goo
- Issue Date
- Feb-2021
- Publisher
- Scitec Publications Ltd.
- Keywords
- Ceria removal; Oxide Post-CMP Cleaning; PVA Brush loading; Zeta-potential Reaxys Chemistry database information
- Citation
- Solid State Phenomena, v.314, pp 259 - 263
- Pages
- 5
- Indexed
- SCOPUS
- Journal Title
- Solid State Phenomena
- Volume
- 314
- Start Page
- 259
- End Page
- 263
- URI
- https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/113553
- DOI
- 10.4028/www.scientific.net/SSP.314.259
- ISSN
- 1012-0394
1662-9779
- Abstract
- Brush scrubbing is a well-known post CMP cleaning process. Interaction between PVA brush and the particles removed during the process must be considered while designing a cleaning process. In this work, the effect of cleaning solution pH was investigated in terms of particle removal from the wafer and subsequent loading to the PVA brush nodule. Higher cleaning of particles from wafer was observed for pH 2 and 12 cleaning solutions and poor cleaning for pH 7 cleaning solution. In contrast, the brushes were loaded heavily for pH 7 compared to pH 2 and 12. Higher electrostatic attraction between oppositely charged PVA and ceria surfaces provided higher ceria particles loading to PVA brush in acidic and neutral cleaning solutions. This particle loading to PVA brush can further effect cleaning efficiency as well as cross-contamination.
- Files in This Item
-
Go to Link
- Appears in
Collections - COLLEGE OF ENGINEERING SCIENCES > DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING > 1. Journal Articles
![qrcode](https://api.qrserver.com/v1/create-qr-code/?size=55x55&data=https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/113553)
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.