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Galvanic displacement deposition of Ag using citric acid for Cu-to-Cu hybrid bonding
- Issue Date
- Jun-2023
- Publisher
- Institute of Electrical and Electronics Engineers Inc.
- Keywords
- Ag interdiffusion; galvanic displacement; hybrid bonding
- Citation
- 2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023 - Proceedings, pp 1 - 3
- Pages
- 3
- Indexed
- SCOPUS
- Journal Title
- 2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023 - Proceedings
- Start Page
- 1
- End Page
- 3
- ISSN
- 2380-632X
2380-6338
- Abstract
- This study reports Ag deposition for hybrid bonding using galvanic displacement deposition. The galvanic displacement method enables selective deposition only on Cu without any additional process. To uniform Ag layer, citric acid was added. Citric acid suppresses the Cu dissolution and stabilize the Cu surface. The morphologies of Ag layer were observed by scanning electron microscopy (SEM). The deposited Ag atoms has a property of interdiffusion with Cu during bonding process because of the difference of activation energy. Depth-profiling X-ray photoelectron spectroscopy (XPS) shows the interdiffusion between Ag and Cu, and the bonding properties improve with Ag layer. © 2023 IEEE.
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Related Researcher
- Yoo, Bong young
- ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)