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Novel method for nano-surface analysis of Cu CMP chemicals by AFM and microfluidic chip system
- Authors
- Ryu, Heon yul; Han, Kwang min; Cho, Byoung jun; Shima, Shohei; Hamada, Satomi; Hiyama, Hirokuni; Kim, Tae gon; Park, Jin goo
- Issue Date
- Oct-2017
- Publisher
- VDE Verlag GmbH
- Keywords
- Atomic force microscope; Cu slurry chemicals; Microfluidics chip; Selective surface treatment; Step height measurement
- Citation
- ICPT 2017 - International Conference on Planarization/CMP Technology, pp 88 - 93
- Pages
- 6
- Indexed
- SCOPUS
- Journal Title
- ICPT 2017 - International Conference on Planarization/CMP Technology
- Start Page
- 88
- End Page
- 93
- Abstract
- A new method for nano-surface analysis with selective surface treatment is presented in this paper. With this method, the surface of interest is treated with chemicals selectively by using fluidics chip and boundaries of treated surface were analyzed by atomic force microscope. Through measuring the surface level relative to the untreated region, chemical-surface interactions could be assumed. Well-known Cu CMP slurry chemical components such as citric acid, hydrogen peroxide, and benzotriazole were treated on the copper surface with the above-mentioned experimental set, then the etch depth, grown/adsorbed layer thickness, and surface roughness were characterized by AFM measurement. © VDE VERLAG GMBH Berlin Offenbach
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Related Researcher
- Park, Jin Goo
- ERICA 첨단융합대학 (ERICA 신소재·반도체공학전공)