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CD error caused by aberration and its possible compensation by optical proximity correction in extreme-ultraviolet lithography

Authors
Hwang, J.-G.Kim, I.-S.Kim, G.-J.No, H.-R.Kim, B.-H.Oh, H.-K.
Issue Date
Mar-2017
Publisher
SPIE
Keywords
Coma; EUV lithography; OPC
Citation
Proceedings of SPIE - The International Society for Optical Engineering, v.10143
Indexed
SCOPUS
Journal Title
Proceedings of SPIE - The International Society for Optical Engineering
Volume
10143
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/11641
DOI
10.1117/12.2261827
ISSN
0277-786X
Abstract
There has been reports of EUV scanner aberration effects to the patterns down to 18 nm half-pitch (hp). Maximum aberration of the latest EUV scanner is reported as 25 mλ. We believe that the first EUV mass production will be applied to the devices of 16 nm hp, so that we checked the aberration effects on 16 nm periodic line and space patterns and nonperiodic double and five-bar patterns. Coma aberrations of Z7, Z8, Z14 and Z15 Zernike polynomials (ZP) seems to be the dominant ones that make pattern distortion. Non-negligible critical dimension (CD) variation and position shift are obtained with the reported maximum 25 mλ of coma aberration. Optical proximity correction (OPC) is tried to see if this aberration effects can be minimized, so that we can make the desired patterns even though there is a non-correctable scanner aberration. © 2017 SPIE.
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