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유한요소해석법에 의한 PC Modular Panel 내진보강공법 적용 R/C 기둥의 내진성능평가

Authors
이강석
Issue Date
26-Oct-2023
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/116725
Place
그랜드 하이원
Conference Name
2023년 대한건축학회 추계학술발표대회
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COLLEGE OF ENGINEERING SCIENCES > MAJOR IN ARCHITECTURAL ENGINEERING > 2. Conference Papers

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LEE, KANG SEOK
ERICA 공학대학 (MAJOR IN ARCHITECTURAL ENGINEERING)
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