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Copper-to-Copper Direct Bonding Process Using Current-Induced Enhancement Method
- Authors
- 유봉영
- Issue Date
- 2-Jun-2023
- Place
- 미국
- Conference Name
- The 2023 IEEE 73rd Electronic Components and Technology Conference
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Related Researcher
- Yoo, Bong young
- ERICA 첨단융합대학 (ERICA 신소재·반도체공학전공)