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Selective Cu electrodeposition for Through Glass Via (TGV) by Blocking Layer
- Authors
- 유봉영
- Issue Date
- 8-Mar-2023
- Place
- 한국
- Conference Name
- IEEE Electron Devices Technology and Manufacturing(EDTM) 2023
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Related Researcher
- Yoo, Bong young
- ERICA 첨단융합대학 (ERICA 신소재·반도체공학전공)