Effect of Cu Addition on Magnetic Properties and Microstructures of SmFe11Ti Alloys Prepared by Melt-Spinning
- Authors
- Lee, Hansol; Kim, Jongryoul
- Issue Date
- May-2023
- Publisher
- Institute of Electrical and Electronics Engineers Inc.
- Keywords
- coercivity; intergranular phase; melt-spinning; ThMn<sub>12</sub>
- Citation
- 2023 IEEE International Magnetic Conference - Short Papers (INTERMAG Short Papers), pp 1 - 2
- Pages
- 2
- Indexed
- SCOPUS
- Journal Title
- 2023 IEEE International Magnetic Conference - Short Papers (INTERMAG Short Papers)
- Start Page
- 1
- End Page
- 2
- URI
- https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/117951
- DOI
- 10.1109/INTERMAGShortPapers58606.2023.10228237
- ISSN
- 0000-0000
- Abstract
- The effect of Cu addition on the magnetic properties and microstructures of SmFe11Ti alloy ribbons has been investigated. In this study, the cooling rate of melt-spinning process and post heat treatment have been carried out to control the final microstructures. It was found that the Cu addition brought significant coercivity enhancement of the SmFe11Ti ribbons fabricated at low cooling rate. In particular, the coercivity of the Sm1.2Fe11TiCu0.4 alloy reached 6.1 kOe at a wheel speed of 20 m/s. This increase in coercivity could be due to the formation of Sm-Cu rich intergranular phase in the alloy. © 2023 IEEE.
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