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Novel Interconnect Processes for Advanced Semiconductor Packaging
- Authors
- 유봉영
- Issue Date
- 21-Aug-2024
- Place
- 일본
- Conference Name
- ISOCC 21st International SoC Design Conference
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Related Researcher
- Yoo, Bong young
- ERICA 첨단융합대학 (ERICA 신소재·반도체공학전공)