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Cu-Cu Bonding in Semiconductor Packaging: Utilizing Texture Control for Enhanced Performance
- Authors
- 유봉영
- Issue Date
- 10-Oct-2024
- Place
- 미국
- Conference Name
- 2024 ECS Fall
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Related Researcher
- Yoo, Bong young
- ERICA 첨단융합대학 (ERICA 신소재·반도체공학전공)