Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
Investigation on the Effects of Slurry Additives and Pad Morphology in Cu CMP for Hybrid Cu Bonding
- Authors
- 박진구
- Issue Date
- 1-Oct-2024
- Place
- Boston
- Conference Name
- IMAPS Symposium 2024
- Files in This Item
- There are no files associated with this item.
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
Related Researcher
- Park, Jin Goo
- ERICA 첨단융합대학 (ERICA 신소재·반도체공학전공)