Detailed Information

Cited 0 time in webofscience Cited 0 time in scopus
Metadata Downloads

Interface-driven structural engineering of polypropylene carbonate-modified MgO composites for enhanced thermal conductivity

Authors
Lee, Ye-JiPark, Ji YoungCho, Hong-BaekChoa, Yong-Ho
Issue Date
Jun-2025
Publisher
Elsevier Ltd
Keywords
Epoxy matrix composites; Magnesium oxide; Polypropylene carbonate; Thermal conductivity; Thermal interface materials
Citation
Composites Science and Technology, v.266, no.16, pp 1 - 9
Pages
9
Indexed
SCIE
SCOPUS
Journal Title
Composites Science and Technology
Volume
266
Number
16
Start Page
1
End Page
9
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/125267
DOI
10.1016/j.compscitech.2025.111177
ISSN
0266-3538
1879-1050
Abstract
As electric vehicle (EV) batteries evolve toward higher energy densities, the demand for advanced thermal interface materials (TIMs) with high thermal conductivity (TC), superior mechanical strength, and anti-hydration properties becomes critical. TIMs must effectively dissipate heat while maintaining structural integrity under harsh thermal and humid conditions to ensure long-term reliability. In this study, we developed a high-performance epoxy composite incorporating thermally and chemically engineered magnesium oxide (MgO) fillers. The MgO was modified via thermal treatment and polypropylene carbonate (PPC) surface functionalization, forming a 365 nm hydrophobic coating layer while increasing the average grain size from 0.9 μm to 22 μm. This novel approach significantly mitigated Mg(OH)2 formation after 120 h in deionized water at 50 °C.Furthermore, the interface engineering between PPC-modified MgO and epoxy enhanced phonon transport while reducing interfacial resistance, leading to a 65 % increase in tensile stress and a TC enhancement from 1.192 W/mK to 2.036 W/mK. By optimizing the high-density packaging (HDP) process, we achieved an unprecedented TC of 9.22 W/mK at a filler content of 75.1 vol%, surpassing conventional epoxy-based TIMs. This study demonstrates a synergistic strategy combining grain boundary engineering, interfacial optimization, and dense filler packing to develop next-generation TIMs. © 2025 Elsevier Ltd
Files in This Item
Go to Link
Appears in
Collections
ETC > 1. Journal Articles

qrcode

Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.

Related Researcher

Researcher CHOA, YONG HO photo

CHOA, YONG HO
ERICA 첨단융합대학 (ERICA 신소재·반도체공학전공)
Read more

Altmetrics

Total Views & Downloads

BROWSE