Interface-driven structural engineering of polypropylene carbonate-modified MgO composites for enhanced thermal conductivity
- Authors
- Lee, Ye-Ji; Park, Ji Young; Cho, Hong-Baek; Choa, Yong-Ho
- Issue Date
- Jun-2025
- Publisher
- Elsevier Ltd
- Keywords
- Epoxy matrix composites; Magnesium oxide; Polypropylene carbonate; Thermal conductivity; Thermal interface materials
- Citation
- Composites Science and Technology, v.266, no.16, pp 1 - 9
- Pages
- 9
- Indexed
- SCIE
SCOPUS
- Journal Title
- Composites Science and Technology
- Volume
- 266
- Number
- 16
- Start Page
- 1
- End Page
- 9
- URI
- https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/125267
- DOI
- 10.1016/j.compscitech.2025.111177
- ISSN
- 0266-3538
1879-1050
- Abstract
- As electric vehicle (EV) batteries evolve toward higher energy densities, the demand for advanced thermal interface materials (TIMs) with high thermal conductivity (TC), superior mechanical strength, and anti-hydration properties becomes critical. TIMs must effectively dissipate heat while maintaining structural integrity under harsh thermal and humid conditions to ensure long-term reliability. In this study, we developed a high-performance epoxy composite incorporating thermally and chemically engineered magnesium oxide (MgO) fillers. The MgO was modified via thermal treatment and polypropylene carbonate (PPC) surface functionalization, forming a 365 nm hydrophobic coating layer while increasing the average grain size from 0.9 μm to 22 μm. This novel approach significantly mitigated Mg(OH)2 formation after 120 h in deionized water at 50 °C.Furthermore, the interface engineering between PPC-modified MgO and epoxy enhanced phonon transport while reducing interfacial resistance, leading to a 65 % increase in tensile stress and a TC enhancement from 1.192 W/mK to 2.036 W/mK. By optimizing the high-density packaging (HDP) process, we achieved an unprecedented TC of 9.22 W/mK at a filler content of 75.1 vol%, surpassing conventional epoxy-based TIMs. This study demonstrates a synergistic strategy combining grain boundary engineering, interfacial optimization, and dense filler packing to develop next-generation TIMs. © 2025 Elsevier Ltd
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