A New High-Frequency Characterization for Coupled Transmission Lines Fabricated on Lossy Organic Substrates
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Joonhyun | - |
dc.contributor.author | Shin, Junggeun | - |
dc.contributor.author | Lee, Donghun | - |
dc.contributor.author | Eo, Yungseon | - |
dc.date.accessioned | 2021-06-22T09:08:04Z | - |
dc.date.available | 2021-06-22T09:08:04Z | - |
dc.date.issued | 2020-02 | - |
dc.identifier.issn | 2156-3950 | - |
dc.identifier.issn | 2156-3985 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/1313 | - |
dc.description.abstract | In this article, a novel experimental characterization technique for coupled transmission lines fabricated on organic substrates is presented. The high-frequency characterizations of transmission lines fabricated on organic substrates are extremely difficult due to parasitic resonances. We eliminated the parasitic resonance effects by combining physical circuit models with experimental characterizations. The reconstructed coupled transmission-line parameters obtained using the proposed technique are compared from 10 MHz to 40 GHz with the measurement data using a vector network analyzer (VNA). The transmission-line parameters using S-parameter measurement data are too contaminated with external noise, whereas those using the proposed technique can effectively eliminate the parasitic effects. | - |
dc.format.extent | 8 | - |
dc.language | 영어 | - |
dc.language.iso | ENG | - |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
dc.title | A New High-Frequency Characterization for Coupled Transmission Lines Fabricated on Lossy Organic Substrates | - |
dc.type | Article | - |
dc.publisher.location | 미국 | - |
dc.identifier.doi | 10.1109/TCPMT.2019.2962831 | - |
dc.identifier.scopusid | 2-s2.0-85079485145 | - |
dc.identifier.wosid | 000519134500011 | - |
dc.identifier.bibliographicCitation | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.2, pp 272 - 279 | - |
dc.citation.title | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | - |
dc.citation.volume | 10 | - |
dc.citation.number | 2 | - |
dc.citation.startPage | 272 | - |
dc.citation.endPage | 279 | - |
dc.type.docType | Article | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalWebOfScienceCategory | Engineering, Manufacturing | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.subject.keywordPlus | MULTIMODE TRL | - |
dc.subject.keywordPlus | PERMITTIVITY | - |
dc.subject.keywordPlus | PARAMETERS | - |
dc.subject.keywordAuthor | Coupled transmission lines | - |
dc.subject.keywordAuthor | high-frequency measurement | - |
dc.subject.keywordAuthor | modeling | - |
dc.subject.keywordAuthor | organic material | - |
dc.subject.keywordAuthor | scattering parameters | - |
dc.identifier.url | https://ieeexplore.ieee.org/document/8945209 | - |
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