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Evaluation of various composition Cu-resin plates in sapphire DMP (Diamond Mechanical Polishing) process
- Issue Date
- Feb-2016
- Publisher
- Institute of Electrical and Electronics Engineers Inc.
- Citation
- 2015 International Conference on Planarization/CMP Technology, ICPT 2015, pp.1 - 4
- Indexed
- SCIE
SCOPUS
- Journal Title
- 2015 International Conference on Planarization/CMP Technology, ICPT 2015
- Start Page
- 1
- End Page
- 4
- Abstract
- In this study, the performance of sapphire lapping process using copper-resin plates in DMP (Diamond Mechanical Polishing) process was evaluated. Material removal rate (MRR) of sapphire increased linearly with the increase in rotation speed, pressure and lapping process time. MRR and roughness of sapphire wafers were correlated to the hardness of lapping plates with different Cu compositions. Cu-resin plates could achieve a good surface quality and proper removal rate of sapphire wafer as compared to metal plates. Also the sapphire removal mechanism was discussed based on the experimental results. © 2015 American Vacuum Society.
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Related Researcher
- Park, Jin Goo
- ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)