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Comparison between sapphire lapping processes using 2-body and 3-body modes as a function of diamond abrasive size
- Issue Date
- May-2015
- Publisher
- Elsevier BV
- Keywords
- Lapping; Sapphire; Fixed abrasive pad; Diamond; Metal-resin platen
- Citation
- Wear, v.332-333, pp 794 - 799
- Pages
- 6
- Indexed
- SCI
SCIE
SCOPUS
- Journal Title
- Wear
- Volume
- 332-333
- Start Page
- 794
- End Page
- 799
- ISSN
- 0043-1648
1873-2577
- Abstract
- Lapping for sapphire substrates was evaluated with respect to material removal modes. Firstly, a 3-body removal mode that consists of diamond slurry and a metal-resin platen was tested. The metal-resin platen was produced by mixing metal particles (Cu, Al, and Sn) and resin. Secondly, we analyzed a 2-body system using a fixed diamond abrasive pad with a low concentration of alumina slurry as a dressing for the pad surface. For each lapping process, we examined the function of the diamond abrasive particles. The fundamental characteristics of each process were observed to suggest optimal conditions for sapphire processing for various applications. (C) 2015 Elsevier B.V. All rights reserved.
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Related Researcher
- Park, Jin Goo
- ERICA 첨단융합대학 (ERICA 신소재·반도체공학전공)