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Efficient diagnosis technique for aging defects on automotive semiconductor chips

Authors
Jung, JihunAnsari, M.A.Kim, DooyoungYi, HyunbeanPark, Sungju
Issue Date
May-2015
Publisher
Institute of Electrical and Electronics Engineers Inc.
Keywords
aging monitoring; on-line test; scan flip-flop
Citation
Proceedings - 2015 20th IEEE European Test Symposium, ETS 2014, pp 1 - 2
Pages
2
Indexed
SCIE
SCOPUS
Journal Title
Proceedings - 2015 20th IEEE European Test Symposium, ETS 2014
Start Page
1
End Page
2
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/20578
DOI
10.1109/ETS.2015.7138767
ISSN
1530-1877
1558-1780
Abstract
The semiconductor aging is one of the serious threats for the reliability of the system. This paper presents an efficient mechanism for predicting the aging effect. The captured data will be unloaded by shift operation, then verified through the aging monitoring operation. Especially the aging level of automotive semiconductor devices can be estimated by controlling the capture timing. Since the aging monitoring function is efficiently on and off during normal operation, power consumption can be reduced significantly compared with other approaches. © 2015 IEEE.
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