Submicron particle removal during FPD oxide TFT process

Abstract

In panel manufacturing processes, cleaning process was not considered to be critical thus far. However, as pixel size is becoming smaller nowadays, the number of pixels per unit area is gradually increasing due to the high resolution. Consequently, an influence of submicron sized contaminated particles is increasing, and hence attention needs to be given to cleaning process. For a large area and high resolution panel with a good production yield, a research on an effective cleaning process which can remove the contaminated particles deposited on the Cu, SiO2 and ITO surfaces is required. Generally, physical cleaning processes are used to remove the submicron particles in FPD (Flat Panel Display) process. In this study, we have optimized these cleaning processes to remove the submicron particles from the substrate surface. Here, we achieved a high cleaning efficiency of above 95% in the EIW megasonic cleaning process on all the substrates. © The Electrochemical Society.