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The effect of fluid pH for 2-body lapping process
- Authors
- Kim, Hyuk min; Seo, Young gil; Park, Jin-Goo
- Issue Date
- Nov-2014
- Publisher
- Institute of Electrical and Electronics Engineers Inc.
- Citation
- ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014, pp 317 - 320
- Pages
- 4
- Indexed
- SCIE
SCOPUS
- Journal Title
- ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014
- Start Page
- 317
- End Page
- 320
- Abstract
- Glass ceramics is one of the key materials for the optoelectronic devices. Lapping is a critical technology which controls the thickness and flatness of the substrate. The modified lapping process using the fixed diamond abrasive pad with DIW (De-ionized water) was evaluated and suggested in the previous our study to replace the conventional process which has problems in terms of environment and CoO (Cost of Ownership). In this study, the effect of DIW pH on the glass lapping process was investigated fundamentally. It was found that the removal behavior of for SiO2 materials as the function of fluid pH was different compared to the reported literatures. © 2014 IEEE.
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Related Researcher
- Park, Jin Goo
- ERICA 첨단융합대학 (ERICA 신소재·반도체공학전공)