Modulation of crystal structure and electrical properties of Hf0.6Zr0.4O2 thin films by Al-doping
- Authors
- Lee, Seung Won; Kim, Chang-Min; Choi, Jeong-Hun; Hyun, Cheol-Min; Ahn, Ji-Hoon
- Issue Date
- Oct-2019
- Publisher
- Elsevier BV
- Keywords
- Dielectric; Thin films; Doping technique; Crystal structure; Atomic layer deposition
- Citation
- Materials Letters, v.252, pp.56 - 59
- Indexed
- SCIE
SCOPUS
- Journal Title
- Materials Letters
- Volume
- 252
- Start Page
- 56
- End Page
- 59
- URI
- https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/2105
- DOI
- 10.1016/j.matlet.2019.05.112
- ISSN
- 0167-577X
- Abstract
- The electrical properties of Hf- and Zr-based oxide thin films, which are related to their crystal structure, are sensitively dependent on their composition and process conditions. In particular, HfZrO2 mixed thin films, which have potential applicability as high-k dielectrics, can have various polarization phases, including paraelectric, ferroelectric, and anti-ferroelectric phases. Therefore, we investigated the enhancement of the dielectric properties of HfZrO2 thin films upon Al doping by confirming their polarization characteristics. Doping of the HfZrO2 thin film with a small amount of Al (similar to 2.5%) caused a remarkable increase in the dielectric constant to similar to 47 and modified the polarization phase from ferroelectric to paraelectric, and the doped film subsequently showed an excellent leakage current of about 2 x 10(-8) A/cm(2) at +/- 1 MV/cm. On the basis of these findings, we believe that Al-doped HfZrO2 films are promising candidates for use as paraelectric high-k dielectrics for dynamic random access memory capacitors, as gate dielectrics for high-speed transistors, and so on. (C) 2019 Elsevier B.V. All rights reserved.
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