Removal of UV-cured resin using a hybrid cleaning process for nanoimprint lithography
- Authors
- Kim, Min-Su; Kang, Bong-Kyun; Ramachandran, Manivannan; Kim, Jae-Kwan; Lee, Byung-Kyu; Park, Jin-Goo
- Issue Date
- Feb-2014
- Publisher
- Elsevier BV
- Keywords
- UV-cured resin removal; UV/O-3 pretreatment; DIO3 cleaning; Megasonic
- Citation
- Microelectronic Engineering, v.114, pp.126 - 130
- Indexed
- SCIE
SCOPUS
- Journal Title
- Microelectronic Engineering
- Volume
- 114
- Start Page
- 126
- End Page
- 130
- URI
- https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/23749
- DOI
- 10.1016/j.mee.2013.05.005
- ISSN
- 0167-9317
- Abstract
- Removal of resin residues from quartz surfaces is one of the most critical issues in ultraviolet (UV) nanoimprint lithography (NIL) processes. Traces of resin residues on a quartz stamp cause pattern defects in the subsequent UV NIL process. This study investigates the effect of UV/O-3 pretreatment and ozone dissolved water (DIO3) cleaning with megasonic (MS) on UV-cured resin removal. The bulk resin was oxidized and removed partly by UV/O-3 pretreatment. The resin residues which remained on the surface in the form of a thin layer were removed by cleaning with 40 ppm DIO3 along with megasonic. Subsequently, cleaning was performed using a 10% KOH solution to remove the adhesion promoter. Contact angle measurements showed that the surface was hydrophilic in nature, which confirms the complete removal of the UV-cured resin and adhesion promoter from the SiO2 substrate. (C) 2013 Elsevier B.V. All rights reserved.
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