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Fabrication of highly sensitive capacitive pressure sensors with porous PDMS dielectric layer via microwave treatment

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dc.contributor.authorKim, Yeongjun-
dc.contributor.authorJang, Shin-
dc.contributor.authorOh, Je Hoon-
dc.date.accessioned2021-06-22T09:43:22Z-
dc.date.available2021-06-22T09:43:22Z-
dc.date.created2021-01-21-
dc.date.issued2019-07-
dc.identifier.issn0167-9317-
dc.identifier.urihttps://scholarworks.bwise.kr/erica/handle/2021.sw.erica/2437-
dc.description.abstractThis work aims to present a flexible, highly sensitive, capacitive pressure sensor based on an elastomeric dielectric layer with uniformly distributed micro-pores. The porous dielectric layer was simply produced by microwave treatment of polydimethylsiloxane (PDMS) mixed with a sacrificial solvent within a few minutes. The pressure sensor using a porous PDMS dielectric layer fabricated with 40 wt% sacrificial solvent had a sensitivity of 0.813 kPa(-1), which is 11 times higher than that of the sensor using a non-porous dielectric layer. To further improve the sensitivity, low-cost commercial glass was used as a mold to form microstructures on the surface of the porous dielectric layer. Due to the enhanced deformability, high sensitivity of 1.43 kPa(-1) and a fast response time of 70 ms was achieved. The performances of a sensor array as well as finger sensors were also demonstrated by placing light-weight objects on the array and holding a plastic cup. It would be expected that the proposed sensors could be utilized in the application of artificial skins or soft robotics.-
dc.language영어-
dc.language.isoen-
dc.publisherELSEVIER-
dc.titleFabrication of highly sensitive capacitive pressure sensors with porous PDMS dielectric layer via microwave treatment-
dc.typeArticle-
dc.contributor.affiliatedAuthorOh, Je Hoon-
dc.identifier.doi10.1016/j.mee.2019.111002-
dc.identifier.scopusid2-s2.0-85066414768-
dc.identifier.wosid000480665600031-
dc.identifier.bibliographicCitationMICROELECTRONIC ENGINEERING, v.215, pp.1 - 7-
dc.relation.isPartOfMICROELECTRONIC ENGINEERING-
dc.citation.titleMICROELECTRONIC ENGINEERING-
dc.citation.volume215-
dc.citation.startPage1-
dc.citation.endPage7-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.description.journalClass1-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaScience & Technology - Other Topics-
dc.relation.journalResearchAreaOptics-
dc.relation.journalResearchAreaPhysics-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalWebOfScienceCategoryNanoscience & Nanotechnology-
dc.relation.journalWebOfScienceCategoryOptics-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.subject.keywordPlusELASTOMER-
dc.subject.keywordAuthorPressure sensor-
dc.subject.keywordAuthorPorous structures-
dc.subject.keywordAuthorMicrowave treatment-
dc.subject.keywordAuthorPolydimethylsiloxane (PDMS)-
dc.subject.keywordAuthorSurface microstructure-
dc.subject.keywordAuthorCapacitance-
dc.identifier.urlhttps://www.sciencedirect.com/science/article/pii/S0167931719301534?via%3Dihub-
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ERICA 공학대학 (DEPARTMENT OF MECHANICAL ENGINEERING)
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