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Effects of Pump-Induced Particle Agglomeration During Chemical Mechanical Planarization (CMP)
- Issue Date
- Nov-2014
- Publisher
- IEEE
- Citation
- 2014 INTERNATIONAL CONFERENCE ON PLANARIZATION/CMP TECHNOLOGY (ICPT), pp.254 - 258
- Indexed
- SCIE
SCOPUS
- Journal Title
- 2014 INTERNATIONAL CONFERENCE ON PLANARIZATION/CMP TECHNOLOGY (ICPT)
- Start Page
- 254
- End Page
- 258
- Abstract
- In this study, the effects of large particle in chemical mechanical planarization (CMP) slurry were investigated on slurry distribution system, which utilizes a pumping device to circulate CMP slurry. Three different types of pumps (e.g., bellows, diaphragm and magnetically levitated centrifugal pump) were evaluated their performance such as generation of agglomerated particle and defectivity in different of slurries (Ceria slurry, Silica slurry a, Silica slurry b).
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Related Researcher
- Park, Jin Goo
- ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)