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Effect of Hydrogen Peroxide(H2O2) in Citric Acid Based Cu Slurry on Cu CMP

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dc.contributor.author박진구-
dc.date.accessioned2021-06-23T05:11:25Z-
dc.date.available2021-06-23T05:11:25Z-
dc.date.issued2004-08-08-
dc.identifier.urihttps://scholarworks.bwise.kr/erica/handle/2021.sw.erica/30376-
dc.titleEffect of Hydrogen Peroxide(H2O2) in Citric Acid Based Cu Slurry on Cu CMP-
dc.typeConference-
dc.citation.conferenceName9th International Symposium on Chemical-Mechanical Planarization-
dc.citation.conferencePlaceLake Placid, NY-
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COLLEGE OF ENGINEERING SCIENCES > DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING > 2. Conference Papers

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ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)
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